6/8/10/12 inch wafer chip uv film debonding machine
21146/8/10/12 inch wafer chip UV film debonding machines are essential tools in semiconductor manufacturing, providing efficient debonding of UV-cured adhesives from wafer chips
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Futansi®, a leading UV LED curing technology manufacturer at the forefront of industrial technology, had developed a new UV oven currently. Which is a three-sided illumination LED UV oven.

What: three-sided illumination LED UV oven with the specifications:
· UV wavelength available from 365-405 nm;
· Curing UV energy at 500-1000 mJ/cm2;
· The illumination size up to 200*200mm;
· Adjustable of illumination power & time.
About Futansi:
Futansi® is a prominent manufacturer at the forefront of industrial technology, dedicated to providing cutting-edge photonic solutions tailored to suit the requirements of Original Equipment Manufacturers (OEMs) and end-users alike. Our expertise spans a broad spectrum, encompassing illumination, optics, optoelectronics, sensing, detection, and imaging technologies.
We cater to a diverse range of industries, including biomedical, scientific research, semiconductor, industrial manufacturing, public safety, security, consumer goods, military, and aerospace. At Futansi, our mission is to empower the success of our customers by addressing their varied needs across these multiple sectors.
Futansi operates with an international presence that encompasses North America, Europe, and Asia. Our team is dedicated to delivering exceptional service and support to our clients all around the world.
Connect with Futansi on Facebook, Twitter and Youtube, or visit https://www.futansi-uv.com/ for more information.
Contacts:
Lyna Sia
Senior Director of Marketing
sales07@futansi.com
+86 (176) 2129-8129
6/8/10/12 inch wafer chip UV film debonding machines are essential tools in semiconductor manufacturing, providing efficient debonding of UV-cured adhesives from wafer chips
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